Associate Engineer (Flip Chip & Post Mold Process) s-pass & Ep
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Position: Associate Engineer (Flip Chip & Post Mold Process)
Location: Serangoon North, Singapore
Emp Type Full Time
Responsibilities
.
• Perform equipment setup and buyoff. Troubleshooting whenever necessary.
• Monitor process output parameter to ensure fulfillment of requirements and specifications provided.
• Support engineering build related to new packaging / process for customer sampling or internal evaluations.
• Run evaluations per plan and collect and compile necessary data for analysis.
Requirements
.
• 1- 3 years working experience in Flip Chip Processes such as FC Attach, Underfill or Post Mold Processes such as Ball Mount, Laser Marking, VM etc
• Diploma in Engineering or equivalent.
• Good problem solving and computer skills
• Willingness to work shift and support 24/7.
Location: Serangoon North, Singapore
Emp Type Full Time
Responsibilities
.
• Perform equipment setup and buyoff. Troubleshooting whenever necessary.
• Monitor process output parameter to ensure fulfillment of requirements and specifications provided.
• Support engineering build related to new packaging / process for customer sampling or internal evaluations.
• Run evaluations per plan and collect and compile necessary data for analysis.
Requirements
.
• 1- 3 years working experience in Flip Chip Processes such as FC Attach, Underfill or Post Mold Processes such as Ball Mount, Laser Marking, VM etc
• Diploma in Engineering or equivalent.
• Good problem solving and computer skills
• Willingness to work shift and support 24/7.
