Engineer (Wafer Prep)
Support engineering build related to new packaging / process for customer sampling or internal evaluations.
Provide support in documentation for process control during technology offload to assembly.
Run evaluations per plan and collect necessary data for analysis.
Liaise with suppliers to identify improvements required on equipment or materials.
At least 3 years' experience in IC assembly companies, in Front-Of-Line (FOL).
Degree in Engineering or equivalent.
Good problem solving, communication and presentation skills
Knowledge of Statistical Process Control (SPC) and Design of Experiments (DOE)